Samsung, SK Hynix Race to Solve HBM5 Thermal Crisis for AI Chips
Memory makers are spending billions on cooling solutions as AI accelerators push power limits
At COMPUTEX 2026 in Taipei (June 2-5), Samsung unveiled its HBM5 mock-up alongside a new thermal architecture called HPB (Heat Path Block). The technology creates dedicated thermal pathways within the memory stack, particularly around the D2D PHY interface — one of the primary heat sources inside high-bandwidth memory packages. Samsung claims the technology, already validated in HBM4E, can reduce thermal resistance by up to 16%.
SK Hynix and Micron presented their own approaches at the same event. SK Hynix is betting on hybrid bonding with integrated microfluidic channels, while Micron is pursuing a materials-first strategy with new thermal interface materials (TIMs) that offer 3x the thermal conductivity of conventional compounds.
Why thermal management is the new bottleneck
AI accelerators are consuming unprecedented amounts of power. NVIDIA’s B300 GPU draws up to 1,200 watts, and next-generation Rubin chips are expected to push past 1,500W. When you stack 8 or 12 HBM dies on top of a logic chip, the heat density becomes extreme.
“We’re hitting the thermal wall before we hit the compute wall,” said Dr. Lee Jung-hoon, VP of memory development at Samsung Electronics, during a COMPUTEX panel on June 3. “The chip can theoretically process more data, but we can’t keep it cool enough to do so reliably.”
Market implications
The HBM market is projected to reach $38 billion in 2026, up from $16 billion in 2025, according to TrendForce. SK Hynix currently holds roughly 53% market share, followed by Samsung at 35% and Micron at 12%. The thermal management challenge could reshuffle these numbers — whichever company solves cooling first gains a significant advantage in next-generation AI chip deployments.
Chinese memory maker CXMT (ChangXin Memory Technologies) is also entering the HBM race, though its initial products target the HBM2E segment rather than cutting-edge HBM5. CXMT’s advantage is price: its HBM2E modules are reportedly 30-40% cheaper than SK Hynix equivalents.
Supply chain impact
The thermal challenge is creating opportunities across the supply chain. Companies making thermal interface materials, liquid cooling systems, and advanced substrates are seeing surging demand. BOE and TCL China Star are developing display-grade heat spreaders that could be adapted for chip packaging.
For AI data center operators, the thermal crisis means higher cooling costs and more complex infrastructure. Liquid cooling, once optional, is becoming mandatory for racks running HBM5-equipped accelerators.
Sources
- TrendForce, “Samsung, SK Hynix and Micron Unveil Different Thermal Strategies for HBM5 Era,” June 2026
- COMPUTEX 2026 keynote and panel transcripts
- FTC Electronics, “Electronics Weekly News,” June 1-7, 2026
- Dell’Oro Group, AI Data Center Switch Market Q1 2026