Samsung SK Hynix Race to Solve HBM5 Thermal Crisis for AI Chips
Memory makers spend billions on cooling as AI accelerators push power limits
At COMPUTEX 2026 in Taipei June 2-5, Samsung unveiled its HBM5 mock-up alongside a new thermal architecture called HPB Heat Path Block. The technology creates dedicated thermal pathways within the memory stack. Samsung claims it can reduce thermal resistance by up to 16 percent.
SK Hynix and Micron presented their own approaches. SK Hynix is betting on hybrid bonding with integrated microfluidic channels, while Micron pursues a materials-first strategy with new thermal interface materials offering 3x thermal conductivity.
Why thermal management is the new bottleneck
AI accelerators consume unprecedented power. NVIDIA B300 draws up to 1,200 watts, next-generation Rubin chips expected past 1,500W. When you stack 8 or 12 HBM dies on top of a logic chip, heat density becomes extreme.
Market implications
HBM market projected to reach 38 billion dollars in 2026, up from 16 billion dollars in 2025 according to TrendForce. SK Hynix holds roughly 53 percent market share, Samsung 35 percent, Micron 12 percent. Chinese memory maker CXMT is entering the HBM race with HBM2E modules reportedly 30-40 percent cheaper.
Sources
- TrendForce HBM5 thermal strategies report June 2026
- COMPUTEX 2026 keynote and panel transcripts
- FTC Electronics Weekly News June 1-7 2026