SemiAnalysis: China’s CXMT Poised to Challenge Micron as DRAM Capacity Surges Toward 2026
On May 27, 2026, the Shanghai Stock Exchange’s listing committee approved the initial public offering of ChangXin Technology Co., Ltd. (长鑫科技, also known as CXMT), clearing the way for what…
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China Chip Ambitions Reshape Global Semiconductor Industry as Memory Prices Surge
By CII (China Industry Intel) – Contributing Analyst | June 24, 2026 China’s relentless push to build a self-sufficient semiconductor industry is reshaping the global chip landscape, triggering a surge…
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Huawei Proposes New Chip Path as China Semiconductor Self-Reliance Drive Intensifies
Huawei proposes a novel chiplet design methodology as China accelerates semiconductor self-sufficiency. SMIC and HLMC expand mature-node capacity while the EUV gap persists. Huawei’s Chip Design Breakthrough Signals New Direction…
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US Alleges ASML EUV Machine Reached China — Both Sides Dig In
By CII (China Industry Intel) – Contributing Analyst | June 20, 2026 US Alleges ASML EUV Machine Reached China — Both Sides Dig In US Commerce Secretary Howard Lutnick has…
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China Semiconductor Equipment Self-Reliance Surges Past 35 Percent
China semiconductor equipment self-reliance reaches 35%, surpassing MIIT target. Naura revenue +42%. By CII (China Industry Intel) – Contributing Analyst | June 20, 2026 China’s semiconductor equipment self-reliance rate has…
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China Chip Self-Sufficiency Drive Reshapes Global Semiconductor Map
China semiconductor self-sufficiency rises to 25-30% as 7B Big Fund III fuels domestic equipment and chip manufacturing ecosystem. At SEMICON China 2026 in Shanghai this March, the exhibition floor told…
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Memory Chip Frenzy Grips Asia as AI Demand Surges
Memory Chip Frenzy Grips Asia as AI Demand Surges Semiconductor Memory Chip Frenzy Grips Asia as AI Demand Surges By China Industry Intelligence · June 18, 2026 · Semiconductor Market…
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China Semiconductor Localization Accelerates Across Supply Chain
What Happened China’s semiconductor localization drive has accelerated sharply in 2026, with domestic chip makers rapidly replacing foreign suppliers across every segment of the supply chain. From electronic design automation…
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Samsung Ships First 12-Layer HBM4E Memory Samples
Samsung Ships First 12-Layer HBM4E Memory Samples as AI Memory Arms Race Escalates June 16, 2026 · Semiconductor · ChinaIndustryIntel Hook: Samsung Electronics has begun shipping industry-first 12-layer HBM4E (High…
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NVIDIA Vera Rubin Platform Launched at COMPUTEX 2026
NVIDIA Vera Rubin Platform Launched at COMPUTEX 2026: 10x Lower Cost Per Token Rewrites the AI Compute Economics June 16, 2026 · Semiconductor · ChinaIndustryIntel Hook: On June 1, 2026,…
